The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2018

Filed:

Mar. 31, 2017
Applicant:

Epistar Corporation, Hsinchu, TW;

Inventors:

Chia Chen Tsai, Hsinchu, TW;

Chen Ou, Hsinchu, TW;

Chi Ling Lee, Hsinchu, TW;

Chi Shiang Hsu, Hsinchu, TW;

Assignee:

EPISTAR CORPORATION, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/20 (2010.01); H01L 33/00 (2010.01); H01L 33/02 (2010.01); H01L 33/62 (2010.01); H01L 33/22 (2010.01);
U.S. Cl.
CPC ...
H01L 33/0095 (2013.01); H01L 33/02 (2013.01); H01L 33/025 (2013.01); H01L 33/20 (2013.01); H01L 33/22 (2013.01); H01L 33/62 (2013.01);
Abstract

A compound semiconductor device comprises a substrate, comprising a top surface, a bottom surface, a side surface connecting the top surface and the bottom surface; and a semiconductor stack formed on the top surface, wherein the side surface comprises a first deteriorated surface, a second deteriorated surface, a first crack surface between the first and second deteriorated surfaces, a second crack surface between the first deteriorated surface and the top surface, and a third crack surface between the second deteriorated surface and the bottom surface, wherein the first and second deteriorated surfaces are rougher than at least one of the first crack surface, the second crack surface and the third crack surface; and wherein the second crack surface is about perpendicular to the top surface, and the third crack surface is about perpendicular to the bottom surface.


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