The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2018
Filed:
Aug. 24, 2015
Boe Technology Group Co., Ltd., Beijing, CN;
Boe Technology Group Co., Ltd., Beijing, CN;
Abstract
Embodiments of the present invention disclose a manufacturing method for an array substrate and corresponding manufacturing device, which belong to the technical field of metal oxide semiconductor. The method comprises: forming an active layer, a gate insulating layer and a gate metal layer successively on a substrate; forming a gate pattern with a gate photoresist pattern on the substrate having the gate metal layer; altering a temperature of the gate photoresist pattern, so as to enable the width of the gate photoresist sub-pattern in the gate photoresist pattern to be changed; forming lightly doped drains (LDDs) at two sides of a preset area of the active layer sub-pattern in the active layer of the substrate having the changed gate photoresist pattern, the preset area being a projection area of the gate sub-pattern on the active layer sub-pattern, the length of each of the LDDs being (a−b)/2, wherein a is the width of the gate photoresist sub-pattern in the changed gate photoresist pattern, b is the width of the gate sub-pattern; stripping the changed gate photoresist pattern. The embodiment of the present invention mitigates or alleviates the problem of relatively low control flexibility and relatively poor feasibility to the LDD length, which improves the control flexibility and feasibility to the LDD length, and can be used for manufacturing an array substrate.