The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2018
Filed:
Mar. 03, 2016
Toshiba Memory Corporation, Tokyo, JP;
Toshiba Memory Corporation, Tokyo, JP;
Abstract
A semiconductor device includes a first substrate, an aluminum pad, a first nickel electrode, a second substrate, a second nickel electrode, and a connection layer. The first substrate includes a wiring therein. The aluminum pad is provided adjacent to a surface layer of the first substrate and is connected to the wiring. A portion of the first nickel electrode extends inwardly of the first substrate and is connected to the aluminum pad. A top surface of the first nickel electrode projects from a surface of the first substrate. A portion of the second nickel electrode extends inwardly of the second substrate. A top surface of the second nickel electrode projects from a surface of the second substrate facing the first substrate. The connection layer comprises an alloy including tin and connects the first nickel electrode and the second nickel electrode.