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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9893026 B1

PDFFull Text
Date of Patent:
Feb. 13, 2018

Filed:

Oct. 29, 2014

Systems, methods and devices for inter-substrate coupling

Applicant:

Elwha Llc, Bellevue, WA (US);

Inventors:

William David Duncan, Mill Creek, WA (US);

Roderick A. Hyde, Redmond, WA (US);

Jordin T. Kare, Seattle, WA (US);

Thomas M. McWilliams, Oakland, CA (US);

Thomas Allan Weaver, San Mateo, CA (US);

Lowell L. Wood, Jr., Bellevue, WA (US);

Assignee:

Elwha LLC, Bellevue, WA (US);

Attorney:
Primary Examiner:

Jesse Y Miyoshi

Assistant Examiner:

Tuan A Hoang

Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 24/00 (2013.01); H01L 23/48 (2013.01); H01L 24/80 (2013.01); H01L 24/81 (2013.01); H01L 25/0657 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/056 (2013.01); H01L 2224/05557 (2013.01); H01L 2224/05686 (2013.01); H01L 2224/11318 (2013.01); H01L 2224/11826 (2013.01); H01L 2224/1369 (2013.01); H01L 2224/819 (2013.01); H01L 2224/81141 (2013.01); H01L 2224/81143 (2013.01);
Abstract

Inter-substrate coupling and alignment using liquid droplets can include electrical and plasmon modalities. For example, a set of droplets can be placed on a bottom substrate. A top substrate can be placed upon the droplets, which uses the droplets to align the substrates. Using the droplets in a capacitive or plasmon coupling modality, information or power can be transferred between the substrates using the droplets.

Find Patent Forward Citations

Quick Actions:

Duncan, William. (2018). Systems, methods and devices for inter-substrate coupling (U.S. Patent No. 9893026). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9893026

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