The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2018

Filed:

Sep. 11, 2015
Applicant:

Analog Devices Global, Hamilton, BM;

Inventors:

Yusuf Alperen Atesal, Istanbul, TR;

Turusan Kolcuoglu, Istanbul, TR;

Assignee:

Analog Devices Global, Hamilton, BM;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/498 (2006.01); H01L 23/64 (2006.01); H01L 23/00 (2006.01); H04B 1/40 (2015.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/49838 (2013.01); H01L 23/642 (2013.01); H01L 23/645 (2013.01); H01L 24/49 (2013.01); H01L 24/48 (2013.01); H01L 2223/6611 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/48157 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/49175 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/10161 (2013.01); H01L 2924/1421 (2013.01); H04B 1/40 (2013.01);
Abstract

A high isolation wideband switch is disclosed. In one aspect, the switch includes an integrated circuit package having an integrated circuit die with a first plurality of leads that is positioned on a package substrate that has a second plurality of leads. The first leads of the integrated circuit die are connected to the second the leads of the package substrate via bond wires and a first electrical coupling occurs between the first leads and the integrated circuit die in response to an RF signal applied to the integrated circuit package. The bond wires have a second electrical coupling in response to the RF signal and the bond wires are arranged such that the second electrical coupling is matched to the first electrical coupling within a selected frequency band so as to reduce the overall electrical coupling of the integrated circuit package for RF signals within the selected frequency band.


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