The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2018
Filed:
Oct. 31, 2016
Applicant:
Fuji Electric Co., Ltd., Kawasaki-shi, Kanagawa, JP;
Inventors:
Tetsuya Inaba, Matsumoto, JP;
Yoshinari Ikeda, Matsumoto, JP;
Assignee:
FUJI ELECTRIC CO., LTD., Kawasaki-Shi, Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/04 (2006.01); H01L 23/373 (2006.01); H01L 23/473 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49844 (2013.01); H01L 23/041 (2013.01); H01L 23/3735 (2013.01); H01L 23/473 (2013.01); H01L 23/49811 (2013.01); H01L 25/072 (2013.01);
Abstract
A semiconductor module includes a plurality of semiconductor chips that include gate electrodes on front surfaces, a gate terminal that receives a control signal from outside, and a print substrate. The print substrate includes a gate wiring layer that separates the control signal that is input into the gate terminal and passes the control signal to the gate electrodes of the semiconductor chips, and a cross-sectional area of the gate wiring layer becomes larger as the gate wiring layer gets closer to the gate terminal from the gate electrodes.