The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2018

Filed:

Aug. 23, 2016
Applicant:

Magnachip Semiconductor, Ltd., Cheongju-si, KR;

Inventors:

Jae Sik Choi, Cheongju-si, KR;

Si Hyeon Go, Cheongju-si, KR;

Jun Young Heo, Incheon-si, KR;

Moon Taek Sung, Sejong-si, KR;

Dong Seong Oh, Incheon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 25/18 (2006.01); H01L 23/373 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); H01L 21/4875 (2013.01); H01L 23/3735 (2013.01); H01L 23/49562 (2013.01); H01L 24/14 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01L 25/18 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/13055 (2013.01);
Abstract

A power semiconductor module includes: a substrate including first, second, and third metal patterns separated from each other, a semiconductor element located on the substrate, a lead frame located on the substrate and including first, second, third, and fourth bodies; a first terminal connected to the first body, a second terminal connected to the second body, and a third common terminal that connects the third body and the fourth body, wherein a length of the third common terminal is longer than that of the first and second terminals.


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