The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2018
Filed:
Oct. 21, 2015
Delta Electronics, Inc., Taoyuan Hsien, Taiwan, CN;
Kai Lu, Taiwan, CN;
Zhenqing Zhao, Taiwan, CN;
Shouyu Hong, Taiwan, CN;
Tao Wang, Taiwan, CN;
Le Liang, Taiwan, CN;
DELTA ELECTRONICS, INC., Taoyuan, Taiwan, CN;
Abstract
The present disclosure discloses a package module of a power conversion circuit and a manufacturing method thereof. The package module of the power conversion circuit is surface-mountable on a system board. The package module of the power conversion circuit includes: a substrate, a power device die, a molding layer and a plurality of pins. The substrate has a metal layer, an insulating substrate layer and a thermal conductive layer. The insulating substrate layer is disposed between the metal layer and the thermal conductive layer. The power device die is coupled to the metal layer. Devices on the metal layer of the substrate are embedded in the molding layer. The plurality of pins is electrically coupled to the metal layer and embedded in the molding layer, at least a contact surface of each of the pins which is electrically coupled to the system board is exposed, and the contact surface is parallel and/or perpendicular to the thermal conductive layer. The package module with this structure occupies a small area, and facilitates batch production.