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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9892994 B1

PDFFull Text
Date of Patent:
Feb. 13, 2018

Filed:

Nov. 19, 2015

Graphene based filler material of superior thermal conductivity for chip attachment in microstructure devices

Applicant:

Stmicroelectronics S.r.l., Agrate Brianza, IT;

Inventors:

Mario Giovanni Scurati, Milan, IT;

Laura Ceriati, Carnate, IT;

Luciano Benini, Cava Manara, IT;

Assignee:

STMICROELECTRONICS S.R.L., Agrate Brianza, IT;

Attorney:

Gardere Wynne Sewell LLP

Primary Examiner:

Michelle Mandala

Int. Cl.
CPC ...
H01L 23/373 (2006.01); B29C 65/48 (2006.01); B29C 65/54 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/42 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3733 (2013.01); B29C 65/4855 (2013.01); B29C 65/4865 (2013.01); B29C 65/54 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 23/373 (2013.01); H01L 23/42 (2013.01); H01L 24/83 (2013.01); H01L 24/97 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29099 (2013.01); H01L 2224/29193 (2013.01); H01L 2224/29393 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/32221 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/83855 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); Y10T 428/30 (2015.01);
Abstract

An integrated circuit chip attachment in a microstructure device is accomplished through the use of an adhesive-based material in which graphene flakes are incorporated. This results in superior thermal conductivity. The spatial orientation of the graphene flakes is controlled, for example by adhering polar molecules to the graphene flakes and exposing the flakes to an external force field, so that the graphene flakes have desired orientations under the integrated circuit chip, alongside of the integrated circuit chip and above the integrated circuit chip.

Find Patent Forward Citations

Scurati, Mario. (2018). Graphene based filler material of superior thermal conductivity for chip attachment in microstructure devices (U.S. Patent No. 9892994). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9892994

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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