The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2018
Filed:
Aug. 11, 2016
Applicant:
Harris Corporation, Melbourne, FL (US);
Inventors:
Michael Raymond Weatherspoon, West Melbourne, FL (US);
Louis Joseph Rendek, Jr., Melbourne, FL (US);
Assignee:
HARRIS CORPORATION, Melbourne, FL (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 23/08 (2006.01); H01L 23/48 (2006.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H05K 1/18 (2006.01); H01L 21/288 (2006.01); H01L 21/48 (2006.01); H01L 21/52 (2006.01); H01L 23/498 (2006.01); H01L 23/522 (2006.01); A61N 1/375 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H01L 23/08 (2013.01); H01L 21/2885 (2013.01); H01L 21/486 (2013.01); H01L 21/4817 (2013.01); H01L 21/4864 (2013.01); H01L 21/52 (2013.01); H01L 21/56 (2013.01); H01L 23/293 (2013.01); H01L 23/481 (2013.01); H01L 23/49805 (2013.01); H01L 23/49827 (2013.01); H01L 23/5226 (2013.01); H01L 23/5389 (2013.01); H01L 24/20 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H05K 1/185 (2013.01); A61N 1/375 (2013.01); A61N 1/3758 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/2402 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/821 (2013.01); H01L 2224/82039 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1421 (2013.01); H05K 1/115 (2013.01); H05K 1/189 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10151 (2013.01);
Abstract
An electronic package includes a semiconductor die, conductive pillars extending outwardly from the semiconductor die, and a liquid crystal polymer (LCP) body surrounding the semiconductor die and having openings therein receiving respective ones of the conductive pillars. A first interconnect layer is on the LCP body and contacts the openings. Conductive bodies are in the openings to connect the conductive pillars to the first interconnect layer.