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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9892980 B1

PDFFull Text
Date of Patent:
Feb. 13, 2018

Filed:

Feb. 21, 2017

Fan-out panel level package and method of fabricating the same

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Younghoon Sohn, Incheon, KR;

Jinsung Kim, Suwon-si, KR;

Yusin Yang, Seoul, KR;

Chungsam Jun, Suwon-si, KR;

Assignee:

Samsung Electronics Co., Ltd., Gyeonggi-do, KR;

Attorney:

Harness, Dickey & Pierce, P.L.C.

Primary Examiner:

Syed Gheyas

Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 21/768 (2006.01); H01L 21/027 (2006.01); H01L 21/311 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/683 (2006.01); H01L 21/56 (2006.01); H01L 21/67 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 22/12 (2013.01); H01L 21/0274 (2013.01); H01L 21/31144 (2013.01); H01L 21/4846 (2013.01); H01L 21/565 (2013.01); H01L 21/67259 (2013.01); H01L 21/6835 (2013.01); H01L 21/76802 (2013.01); H01L 21/76895 (2013.01); H01L 24/06 (2013.01); H01L 24/11 (2013.01); H01L 21/0217 (2013.01); H01L 21/02164 (2013.01); H01L 21/02271 (2013.01); H01L 2221/68345 (2013.01); H01L 2224/02311 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/14131 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/152 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15747 (2013.01);
Abstract

A method of fabricating a package includes providing a mold substrate supporting dies in cavities of a fan-out substrate, detecting positions of the dies with respect to the fan-out substrate, and forming interconnection lines. At least one of the interconnection lines includes a first portion extending from the fan-out substrate to a target position on the cavity disposed between the fan-out substrate and one of the dies the one of the dies disposed at a detected position different from the target position, and a second portion extending from the one die to the fan-out substrate.

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