The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2018

Filed:

Aug. 18, 2016
Applicant:

Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;

Inventors:

Eun-Sung Kim, Seoul, KR;

Kyeong-Mi Lee, Suwon-Si, KR;

Seung-Chul Kwon, Suwon-Si, KR;

Jeong-Ju Park, Hwaseong-Si, KR;

Shi-Yong Yi, Seongnam-Si, KR;

Assignee:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/004 (2006.01); H01L 21/033 (2006.01); H01L 21/027 (2006.01); H01L 21/02 (2006.01); G03F 7/00 (2006.01); G03F 7/40 (2006.01); G03F 7/38 (2006.01); G03F 7/16 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0337 (2013.01); B81C 1/00031 (2013.01); G03F 7/002 (2013.01); G03F 7/0035 (2013.01); G03F 7/165 (2013.01); G03F 7/38 (2013.01); G03F 7/40 (2013.01); H01L 21/0271 (2013.01); H01L 21/02118 (2013.01); H01L 21/02348 (2013.01); H01L 21/0332 (2013.01); B81C 2201/0149 (2013.01);
Abstract

A method of forming a pattern of a semiconductor device includes forming a lower film on a substrate having a first surface and a second surface at different levels, forming an upper film of hydrophobic material on the lower film, forming a block copolymer film on the upper film, phase-separating the block copolymer film to form first patterns spaced apart from one another and a second pattern spanning the first patterns and interposed between a bottom surface of each of the first patterns and the upper film, removing the first patterns, and performing an etch process using the second pattern or a residual part of the second pattern as an etch mask.


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