The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2018

Filed:

Apr. 16, 2015
Applicant:

Institute of Microelectronics, Chinese Academy of Sciences, Beijing, CN;

Inventors:

Huaxiang Yin, Beijing, CN;

Changliang Qin, Beijing, CN;

Zuozhen Fu, Beijing, CN;

Xiaolong Ma, Beijing, CN;

Dapeng Chen, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/336 (2006.01); H01L 21/02 (2006.01); H01L 29/00 (2006.01); H01L 29/775 (2006.01); H01L 29/06 (2006.01); H01L 29/423 (2006.01); H01L 29/786 (2006.01); H01L 21/8234 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02603 (2013.01); H01L 21/823412 (2013.01); H01L 21/823418 (2013.01); H01L 21/823431 (2013.01); H01L 21/823481 (2013.01); H01L 29/00 (2013.01); H01L 29/0673 (2013.01); H01L 29/42392 (2013.01); H01L 29/775 (2013.01); H01L 29/78696 (2013.01);
Abstract

Methods of manufacturing stacked nanowires MOS transistors are disclosed. In one aspect, the method includes forming a plurality of fins along a first direction on a substrate. The method also includes forming stack of nanowires constituted of a plurality of nanowires in each of the fins. The method also includes forming a gate stack along a second direction in the stack of nanowires, the gate stack surrounding the stack of nanowires. The method also includes forming source/drain regions at both sides of the gate stack, the nanowires between the respective source/drain regions constituting a channel region. A stack of nanowires may be formed by a plurality of etching back, laterally etching a trench and filling the trench. The laterally etching process includes isotropic dry etching having an internally tangent and lateral etching, and a wet etching which selectively etches along respective crystallographic directions.


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