The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2018

Filed:

Jan. 11, 2012
Applicants:

Jonathan Hale Hammond, Oak Ridge, NC (US);

Julio Costa, Oak Ridge, NC (US);

Inventors:

Jonathan Hale Hammond, Oak Ridge, NC (US);

Julio Costa, Oak Ridge, NC (US);

Assignee:

Qorvo US, Inc., Greensboro, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/84 (2006.01); H01L 21/02 (2006.01); H01H 49/00 (2006.01); H01H 1/00 (2006.01); H01H 59/00 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
H01H 49/00 (2013.01); B81C 1/0023 (2013.01); H01H 1/0036 (2013.01); H01H 59/0009 (2013.01); B81B 2201/014 (2013.01); B81C 2203/0145 (2013.01);
Abstract

Encapsulated MEMS switches are disclosed along with methods of manufacturing the same. A non-polymer based sacrificial layer is used to form the actuation member of the MEMS switch while a polymer based sacrificial layer is used to form the enclosure that encapsulates the MEMS switch. The first non-polymer based sacrificial layer allows for highly reliable MEMS switches to be manufactured while also protecting the MEMS switch from carbon contamination. The polymer based sacrificial layer allows for the manufacture of more spatially efficient encapsulated MEMS switches.


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