The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2018

Filed:

Mar. 11, 2016
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Yasuhiro Nishisaka, Nagaokakyo, JP;

Yoshito Saito, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/228 (2006.01); H01G 4/008 (2006.01); H01G 4/232 (2006.01); H01G 4/30 (2006.01); H01G 4/12 (2006.01);
U.S. Cl.
CPC ...
H01G 4/2325 (2013.01); H01G 4/12 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01); H01G 4/0085 (2013.01);
Abstract

A multilayer ceramic capacitor contains Ni in internal electrodes, and includes a sintered metal layer containing Cu in external electrodes. At a joined portion between each internal electrode and each external electrode, mutual diffusion layers of Cu and Ni extend across the internal and external electrodes. On each internal electrode, a mutual diffusion layer is present with a thickness t, which is defined by a dimension from a first end surface or a second end surface to an interior end in a longitudinal direction, not smaller than about 0.5 μm and not greater than about 5 μm. On each external electrode, a mutual diffusion layer is present with a thickness t, which is defined by a dimension from the first end surface or the second end surface to an exterior end in the longitudinal direction, not smaller than about 2.5% and not greater than about 33.3% of a thickness tof a sintered metal layer.


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