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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9892834 B1

PDFFull Text
Date of Patent:
Feb. 13, 2018

Filed:

Dec. 26, 2013

Magnetic material and coil component employing same

Applicant:

Taiyo Yuden Co., Ltd., Taito-ku, Tokyo, JP;

Inventors:

Hideki Ogawa, Nakanojou-machi, JP;

Atsushi Tanada, Nakanojou-machi, JP;

Assignee:

TAIYO YUDEN CO., LTD., Tokyo, JP;

Attorney:

Law Office of Katsuhiro Arai

Primary Examiner:

Elvin G Enad

Assistant Examiner:

Kazi Hossain

Int. Cl.
CPC ...
H01F 27/24 (2006.01); H01F 17/04 (2006.01); H01F 5/00 (2006.01); H01F 1/40 (2006.01); B22F 1/02 (2006.01); B22F 3/10 (2006.01); B22F 3/24 (2006.01); C22C 38/02 (2006.01); C22C 38/06 (2006.01); C22C 38/34 (2006.01); H01F 1/26 (2006.01); H01F 1/33 (2006.01); H01F 1/01 (2006.01); H01F 27/28 (2006.01); H01F 1/24 (2006.01);
U.S. Cl.
CPC ...
H01F 1/408 (2013.01); B22F 1/02 (2013.01); B22F 3/1007 (2013.01); B22F 3/24 (2013.01); C22C 38/02 (2013.01); C22C 38/06 (2013.01); C22C 38/34 (2013.01); H01F 1/015 (2013.01); H01F 1/26 (2013.01); H01F 1/33 (2013.01); H01F 27/28 (2013.01); H01F 1/24 (2013.01);
Abstract

A coil component having a magnetic material and a coil formed on a surface of or inside the magnetic material. The magnetic material is constituted by a grain compact formed by compacting multiple metal grains that in turn are constituted by an Fe—Si—M soft magnetic alloy (where M is a metal element that oxidizes more easily than Fe), wherein individual metal grains have oxide film formed at least partially around them; the grain compact is formed primarily via bonding between oxide films formed around adjacent metal grains; and the apparent density of the grain compactis 5.2 g/cmor more, or preferably 5.2 to 7.0 g/cm.

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