The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2018

Filed:

May. 05, 2014
Applicants:

Samson Shahbazi, Roslyn, PA (US);

Steven Grabey, Hazleton, PA (US);

Mark Challingsworth, Glenside, PA (US);

Inventors:

Samson Shahbazi, Roslyn, PA (US);

Steven Grabey, Hazleton, PA (US);

Mark Challingsworth, Glenside, PA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/24 (2006.01); B32B 18/00 (2006.01); B32B 37/06 (2006.01); B32B 38/04 (2006.01); A61N 1/05 (2006.01); H01B 1/14 (2006.01); H01B 1/22 (2006.01); H01B 1/16 (2006.01); C04B 41/45 (2006.01); C08L 1/28 (2006.01); A61L 31/02 (2006.01); A61L 31/18 (2006.01); H05K 3/40 (2006.01); H05K 3/46 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01B 1/16 (2013.01); A61L 31/022 (2013.01); A61L 31/026 (2013.01); A61L 31/18 (2013.01); A61N 1/05 (2013.01); C04B 41/4501 (2013.01); C04B 41/4576 (2013.01); C08L 1/28 (2013.01); H01B 1/22 (2013.01); Y10T 428/24273 (2015.01); Y10T 428/24322 (2015.01);
Abstract

An electroconductive hole plug paste comprising about 60-80 wt % of platinum particles, about 10-20 wt % of AlO, and about 10-20 wt % of organic vehicle, based upon 100% total weight of the paste, wherein the organic vehicle includes at least one viscosity-modifying component in an amount sufficient to provide the electroconductive hole plug paste with a viscosity of about 800-1,500 kcPs, is provided. A ceramic substrate assembly for an implantable medical device having the electroconductive hole plug paste of the invention, and a method of forming the same, are also provided.


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