The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2018

Filed:

Oct. 14, 2015
Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventor:

Akira Ichiki, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/047 (2006.01); G06F 3/044 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/40 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
G06F 3/047 (2013.01); G06F 3/044 (2013.01); H05K 1/0296 (2013.01); H05K 1/115 (2013.01); H05K 3/4007 (2013.01); H05K 3/4038 (2013.01); G06F 2203/04103 (2013.01); G06F 2203/04112 (2013.01); H05K 3/106 (2013.01); H05K 3/4053 (2013.01); H05K 2201/09563 (2013.01); H05K 2201/09681 (2013.01); H05K 2203/125 (2013.01);
Abstract

An object of the invention is to provide a method for more easily manufacturing a touch-panel conductive sheet in which end portions of lead-out wires are collected on one surface side of a substrate with high productivity, and a touch-panel conductive sheet. The method for manufacturing a touch-panel conductive sheet of the invention includes: forming, on a rear surface of a substrate, first detection electrodes and rear surface-side wires of which one ends are electrically connected to the first detection electrodes and the other ends have first pad portions, and on a front surface of the substrate, second detection electrodes, second lead-out wires which are electrically connected to the second detection electrodes, and second pad portions which are arranged at positions opposed to the first pad portions via the substrate; forming through holes penetrating the first pad portions, the substrate, and the second pad portions; and producing through wires which electrically connect the first pad portions and the second pad portions by filling the through holes with a conductive material to form first lead-out wires which include the rear surface-side wires and the through wires and are electrically connected to the first detection electrodes.


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