The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2018
Filed:
Dec. 18, 2015
Makoto Matsushita, Tokyo, JP;
Akira Izutani, Osaka, JP;
Hiroaki Takahashi, Kanagawa, JP;
Yuri Haga, Kanagawa, JP;
Keiichiro Juri, Kanagawa, JP;
Hideaki Yasunaga, Tokyo, JP;
Makoto Matsushita, Tokyo, JP;
Akira Izutani, Osaka, JP;
Hiroaki Takahashi, Kanagawa, JP;
Yuri Haga, Kanagawa, JP;
Keiichiro Juri, Kanagawa, JP;
Hideaki Yasunaga, Tokyo, JP;
RICOH COMPANY, LTD., Tokyo, JP;
Abstract
A semiconductive resin composition includes a plurality of thermoplastic resins forming a sea-island structure including a sea portion and an island portion; and a plurality of conductive fillers. The sea portion includes at least two of the thermoplastic resins, at least one of the at least two of the thermoplastic resins is a copolymer, and the content of the copolymer is from 20% to 60% by weight per 100% by weight of the thermoplastic resins in the sea portion, and the following relation is satisfied:1.5≦≦10wherein A represents an average primary particle diameter of one of the conductive fillers having the smallest average primary particle diameter and B represents an average primary particle diameter of one of the conductive fillers having the largest average primary particle diameter.