The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2018
Filed:
Jun. 29, 2015
Applicant:
Taiyo Ink Mfg. Co., Ltd., Hiki-gun, JP;
Inventors:
Assignee:
TAIYO INK MFG. CO., LTD., Hiki-gun, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); G03F 7/11 (2006.01); G03F 7/038 (2006.01); G03F 7/09 (2006.01); H05K 3/28 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
G03F 7/11 (2013.01); G03F 7/0385 (2013.01); G03F 7/0388 (2013.01); G03F 7/09 (2013.01); H05K 3/287 (2013.01); H05K 3/281 (2013.01); H05K 3/3452 (2013.01); H05K 2201/0129 (2013.01);
Abstract
Provided is a photosensitive dry film capable of forming a solder resist layer that has an excellent filling property of underfill and that exhibits an excellent adhesion with a mold material. The photosensitive dry film according to the present invention is a photosensitive dry film including a supporting film and a photosensitive resin layer provided on one side of the supporting film, wherein the arithmetic average surface roughness Ra of the side of the supporting film on which the photosensitive resin layer is provided is 50 to 390 nm.