The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2018

Filed:

Aug. 05, 2014
Applicant:

Shenzhen China Star Optoelectronics Technology Co., Ltd., Shenzhen, CN;

Inventors:

Ming Hung Shih, Shenzhen, CN;

Jiali Jiang, Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); G02F 1/1343 (2006.01); G02F 1/1368 (2006.01);
U.S. Cl.
CPC ...
G02F 1/134309 (2013.01); G02F 1/1368 (2013.01); G02F 1/13439 (2013.01); H01L 27/124 (2013.01); H01L 27/1288 (2013.01); G02F 2001/134345 (2013.01); G02F 2201/123 (2013.01);
Abstract

The present disclosure discloses a method for manufacturing a HVA pixel electrode and an array substrate. The method comprises: a first metal material is deposited on a substrate, and a first conductive metal layer is formed through etching; a first insulating material and a semiconductor material are deposited on a first conductive metal layer, and an intermediate layer is formed through etching; a second insulating material is deposited on the intermediate layer, and a second conductive metal layer is formed through etching; the second conductive metal layer and an exposed part of the intermediate layer are coated with a second insulating material, and contact holes and a three-dimensional insulating structure are formed through etching; the surface of the insulating structure and the exposed parts of other layers are coated with a transparent conductive material, and a transparent conductive layer is formed through etching. A photomasking procedure is saved, and manufacturing cost is saved. The manufacturing time of array substrate can be shortened, the production capacity can be improved, and the penetration of liquid crystal display panel can be improved.


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