The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2018

Filed:

Jan. 24, 2014
Applicant:

Endress + Hauser Gmbh + Co. KG, Maulburg, DE;

Inventors:

Ulfert Drewes, Mullheim, DE;

Elke Schmidt, Bad Sackingham, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01L 9/00 (2006.01); H05K 1/11 (2006.01); H05K 3/34 (2006.01); G01L 19/00 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
G01L 9/0075 (2013.01); G01L 19/0061 (2013.01); H05K 1/111 (2013.01); H05K 3/341 (2013.01); H05K 3/3421 (2013.01); H05K 1/0218 (2013.01); H05K 1/0306 (2013.01); H05K 1/113 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/2036 (2013.01); Y02P 70/611 (2015.11); Y02P 70/613 (2015.11);
Abstract

Method for soldering a connection element to a connection point on an electrically conductive coating that is suitable for soft-soldering on an insulating surface of a base body using a soft-soldering method; as well as sensors manufactured using this method for which a spatial limitation of the wetting of the coating with soft-solder material, during the process of soft-soldering, is effected by providing a groove in the base body which at least partly surrounds the connection point on the outside. At least a part of the area of the external insulating surface of the base body including the connection point is coated with the coating, and soft-solder material is locally applied to the connection point and the connection element is soldered onto the connection point using the applied soft-solder material in a soft-soldering process.


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