The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2018
Filed:
Jul. 14, 2016
Applicant:
Samsung Sdi Co., Ltd., Yongin-si, Gyeonggi-do, KR;
Inventors:
Ki Hyeok Kwon, Suwon-si, KR;
Min Gyum Kim, Suwon-si, KR;
Joo Young Chung, Suwon-si, KR;
Jin Min Cheon, Suwon-si, KR;
Jin Woo Choi, Suwon-si, KR;
Seung Han, Suwon-si, KR;
Dong Hwan Lee, Suwon-si, KR;
Assignee:
SAMSUNG SDI CO., LTD., Yongin-Si, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); C08G 59/70 (2006.01); B01J 27/182 (2006.01); H01L 23/29 (2006.01); C09J 163/00 (2006.01); C07F 7/04 (2006.01); C07F 9/54 (2006.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); C07F 7/045 (2013.01); C07F 9/5442 (2013.01); C08L 63/00 (2013.01); H01L 23/293 (2013.01); C08L 2201/08 (2013.01); C08L 2203/206 (2013.01); C09J 2203/326 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18161 (2013.01);
Abstract
A phosphonium compound, an epoxy resin composition including the same, a semiconductor device encapsulated with the same, and a method of encapsulating a semiconductor device, the phosphonium compound being represented by Formula 1: