The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2018

Filed:

Sep. 22, 2015
Applicant:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Inventors:

Hidehito Matsuzaki, Yokohama, JP;

Hisashi Kusumori, Itabashi, JP;

Kenichi Nojima, Yokohama, JP;

Toshiyuki Nakano, Yokohama, JP;

Masafumi Takei, Yokohama, JP;

Assignee:

KABUSHIKI KAISHA TOSHIBA, Minato-ku, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 163/00 (2006.01); C09D 7/12 (2006.01); C09D 5/24 (2006.01); C09D 7/14 (2006.01); H02B 13/055 (2006.01); B01F 13/00 (2006.01); B01F 3/14 (2006.01); C08K 3/22 (2006.01); C08K 3/28 (2006.01); C08K 3/34 (2006.01); C08K 7/14 (2006.01); H02G 5/06 (2006.01); H02G 5/08 (2006.01); H01C 7/10 (2006.01); B01F 3/12 (2006.01);
U.S. Cl.
CPC ...
C09D 163/00 (2013.01); B01F 3/14 (2013.01); B01F 13/005 (2013.01); C08K 3/22 (2013.01); C08K 3/28 (2013.01); C08K 3/34 (2013.01); C08K 7/14 (2013.01); C09D 5/24 (2013.01); H02B 13/055 (2013.01); B01F 2003/1278 (2013.01); C08K 2003/2237 (2013.01); C08K 2003/2272 (2013.01); C08K 2003/2275 (2013.01); C08K 2003/2296 (2013.01);
Abstract

There are provided a coating material for electrical equipment, a method for manufacturing a coating material for electrical equipment, and a closed insulating device, capable of suppressing floating and moving around of foreign substances in electrical equipment. A coating material for electrical equipmentin an embodiment includes: a matrix resincomposed of an epoxy resin; a first fillerdispersedly contained in the matrix resinand composed of whiskers having a semiconductive specific volume resistivity; a second fillerdispersedly contained in the matrix resinand composed of particles having a semiconductive specific volume resistivity; and a third fillerdispersedly contained in the matrix resinand composed of a planar, fibrous, or lamellar substance having insulating properties.


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