The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2018

Filed:

Jul. 27, 2016
Applicant:

Elite Electronic Material (Kunshan) Co., Ltd., Kunshan, Jiangsu Province, CN;

Inventors:

Chen Yu Hsieh, Taoyuan, TW;

Yan Zhang, Kunshan, CN;

Assignee:

Elite Electronic Material (Kunshan) Co., Ltd., Kunshan, Jiangsu Province, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 65/48 (2006.01); C08L 71/12 (2006.01); C08J 5/24 (2006.01); C08K 5/53 (2006.01); C09D 171/02 (2006.01); H05K 1/03 (2006.01); C09D 171/12 (2006.01);
U.S. Cl.
CPC ...
C08G 65/485 (2013.01); C08J 5/24 (2013.01); C08K 5/53 (2013.01); C08L 71/126 (2013.01); C09D 171/02 (2013.01); C09D 171/12 (2013.01); H05K 1/0373 (2013.01); C08J 2371/12 (2013.01);
Abstract

Disclosed is a fluorenylidene-diphenol-containing polyphenylene oxide which is defined by the following structural formula wherein D, X, Y, Z and b are defined in the specification. The fluorenylidene-diphenol-modified polyphenylene oxide resin or its prepolymer may be used for producing resin products with better thermal resistance, dielectric property, flame retardancy and lower thermal expansion. Accordingly, the resin products, such as prepregs, laminates or printed circuit boards, are suitable for use in electronic products with high speed and high frequency signal transmission to further improve the reliability, thermal resistance, and dimensional stability of the electronic products.


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