The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2018
Filed:
Jul. 14, 2015
Applicant:
Sumitomo Bakelite Co., Ltd., Tokyo, JP;
Inventors:
W. C. Peter Tsang, Brecksville, OH (US);
Andrew Bell, Brecksville, OH (US);
Assignee:
SUMITOMO BAKELITE CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 5/19 (2006.01); B23K 35/36 (2006.01); C08G 64/16 (2006.01); C09J 169/00 (2006.01); H05K 3/30 (2006.01); C08K 5/3462 (2006.01); C08K 5/3442 (2006.01); C08K 5/09 (2006.01); C08G 64/02 (2006.01); C08K 5/3467 (2006.01); C08K 5/17 (2006.01); C08K 5/31 (2006.01); C08K 5/3415 (2006.01); C08K 5/3445 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
C08G 64/1608 (2013.01); B23K 35/3613 (2013.01); B23K 35/3615 (2013.01); C08K 5/19 (2013.01); C09J 169/00 (2013.01); H05K 3/303 (2013.01); B23K 35/3618 (2013.01); C08G 64/0208 (2013.01); C08K 5/09 (2013.01); C08K 5/175 (2013.01); C08K 5/31 (2013.01); C08K 5/3415 (2013.01); C08K 5/3442 (2013.01); C08K 5/3445 (2013.01); C08K 5/3462 (2013.01); C08K 5/3467 (2013.01); C08L 2205/02 (2013.01); H05K 3/3436 (2013.01); H05K 3/3489 (2013.01); Y02P 70/613 (2015.11);
Abstract
Embodiments in accordance with the present invention provide sacrifical polymer compositions and methods for fabricating electronic devices using such sacrifical polymer compositions where such methods include (1) providing a tacky sacrifical polymer composition that holds components in a desired alignment to one another, (2) providing solder fluxing for effecting electrical coupling; and (3) thermal decomposition or depolymerization of the sacrificial polymer composition to provide essentially residue free surfaces.