The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2018
Filed:
Feb. 27, 2014
Applicant:
Dic Corporation, Tokyo, JP;
Inventors:
Yutaka Satou, Ichihara, JP;
Ayumi Takahashi, Ichihara, JP;
Assignee:
DIC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/092 (2006.01); B32B 27/38 (2006.01); H05K 1/03 (2006.01); H01L 23/29 (2006.01); C08L 63/00 (2006.01); C08G 59/26 (2006.01); C07D 303/27 (2006.01); C07D 307/92 (2006.01); C07D 407/14 (2006.01); C07D 301/28 (2006.01); C08G 59/06 (2006.01); C08G 59/62 (2006.01); C08K 3/04 (2006.01); C08K 7/18 (2006.01); H05K 1/09 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
C08G 59/26 (2013.01); C07D 301/28 (2013.01); C07D 407/14 (2013.01); C08G 59/06 (2013.01); C08G 59/621 (2013.01); C08K 3/04 (2013.01); C08K 7/18 (2013.01); H01L 23/295 (2013.01); H05K 1/0326 (2013.01); H05K 1/0373 (2013.01); H05K 1/09 (2013.01); H01L 2924/0002 (2013.01); H05K 3/285 (2013.01);
Abstract
There is provided an epoxy compound exhibiting excellent heat resistance and flame retardance of a cured product thereof; an epoxy resin containing the epoxy compound; a curable composition and a cured product thereof; and a semiconductor sealing material. The epoxy compound has a diarylene[b,d]furan structure, in which at least one of two arylene groups has a naphthylene skeleton and two arylene groups each include a glycidyloxy group on an aromatic nucleus thereof.
Satou, Yutaka. (2018). Epoxy compound, epoxy resin, curable compound, cured product thereof, semiconductor sealing material, and printed circuit board (U.S. Patent No. 9890237). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9890237
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile