The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2018

Filed:

Feb. 10, 2017
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

John Charles Ehmke, Garland, TX (US);

Virgil Cotoco Ararao, McKinney, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/31 (2006.01); H01L 21/469 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); G02B 26/08 (2006.01); G02B 6/42 (2006.01); G02B 26/00 (2006.01); B82Y 30/00 (2011.01);
U.S. Cl.
CPC ...
B81B 7/0038 (2013.01); B81C 1/00285 (2013.01); B81B 2203/0315 (2013.01); B81C 1/00269 (2013.01); B81C 2201/013 (2013.01); B81C 2201/0108 (2013.01); B81C 2201/0188 (2013.01); B81C 2201/0198 (2013.01); B81C 2201/053 (2013.01); B81C 2203/0109 (2013.01); B81C 2203/035 (2013.01); B82Y 30/00 (2013.01); G02B 6/4204 (2013.01); G02B 6/4208 (2013.01); G02B 6/4248 (2013.01); G02B 26/001 (2013.01); G02B 26/0833 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01024 (2013.01); H01L 2924/01074 (2013.01);
Abstract

In described examples, a hermetic package of a microelectromechanical system (MEMS) structure includes a substrate having a surface with a MEMS structure of a first height. The substrate is hermetically sealed to a cap forming a cavity over the MEMS structure. The cap is attached to the substrate surface by a vertical stack of metal layers adhering to the substrate surface and to the cap. The stack has a continuous outline surrounding the MEMS structure while spaced from the MEMS structure by a distance. The stack has: a first bottom metal seed film adhering to the substrate and a second bottom metal seed film adhering to the first bottom metal seed film; and a first top metal seed film adhering to the cap and a second top metal seed film adhering to the first top metal seed film.


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