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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9889629 B1

PDFFull Text
Date of Patent:
Feb. 13, 2018

Filed:

Jan. 21, 2016

Electronic device manufacturing method and electronic device

Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Naoya Sato, Chino, JP;

Masashi Yoshiike, Chino, JP;

Assignee:

Seiko Epson Corporation, Tokyo, JP;

Attorney:

Workman Nydegger

Primary Examiner:

Elizabeth E Mulvaney

Int. Cl.
CPC ...
B32B 3/02 (2006.01); B32B 7/12 (2006.01); B32B 37/12 (2006.01); B32B 7/14 (2006.01); B32B 15/02 (2006.01); B32B 15/08 (2006.01); B32B 15/18 (2006.01); B32B 27/08 (2006.01); B32B 27/28 (2006.01); B32B 3/26 (2006.01); G02B 5/00 (2006.01);
U.S. Cl.
CPC ...
B32B 7/12 (2013.01); B32B 3/26 (2013.01); B32B 7/14 (2013.01); B32B 15/02 (2013.01); B32B 15/08 (2013.01); B32B 15/18 (2013.01); B32B 27/08 (2013.01); B32B 27/283 (2013.01); B32B 37/1292 (2013.01); G02B 5/00 (2013.01); B32B 2037/1253 (2013.01); B32B 2255/10 (2013.01); B32B 2255/20 (2013.01); B32B 2255/26 (2013.01); B32B 2307/546 (2013.01); B32B 2307/704 (2013.01); B32B 2457/00 (2013.01); B32B 2457/20 (2013.01);
Abstract

An electronic device is manufactured by a method including applying a photosensitive adhesive agent either to a pressure chamber forming substrate and a vibrating plate or to a sealing plate having a structure of a lower height from a bonding surface, precuring the photosensitive adhesive agent by heating, patterning the precured photosensitive adhesive agent, and bonding the substrates together with the structure (bump electrode) and the photosensitive adhesive agent interposed therebetween.

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Sato, Naoya. (2018). Electronic device manufacturing method and electronic device (U.S. Patent No. 9889629). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9889629

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