The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2018

Filed:

Dec. 09, 2016
Applicant:

Hon Hai Precision Industry Co., Ltd., New Taipei, TW;

Inventor:

Kar-Wai Hon, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/26 (2006.01); B29C 45/14 (2006.01); B32B 15/08 (2006.01); B29K 705/00 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
B32B 3/263 (2013.01); B29C 45/14311 (2013.01); B29C 45/14795 (2013.01); B32B 15/08 (2013.01); B29K 2705/00 (2013.01); B29K 2881/04 (2013.01); B29K 2995/0041 (2013.01); B29L 2031/34 (2013.01); B32B 2250/02 (2013.01); B32B 2307/704 (2013.01); B32B 2457/00 (2013.01);
Abstract

A composite of metal and resin and a manufacturing method require a metal piece and a resin piece, and the surface of the metal piece is etched to include a number of micropores. Each micropore includes a first inclined hole and a second inclined hole, the first inclined hole and the second inclined hole diverging from each other below the surface of the metal piece. The first inclined hole and the second inclined hole extend downwards from a common starting hole which is symmetric around an axis perpendicular to the surface of the metal piece. The resin is embedded in the micropores to combine with the metal piece, where the bonding strength of the composite of metal and resin is increased.


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