The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2018

Filed:

Aug. 08, 2014
Applicants:

Shinichi Tabata, Tokyo, JP;

Shigeki Morikami, Tokyo, JP;

Mitsuru Shiokawa, Tokyo, JP;

Inventors:

Shinichi Tabata, Tokyo, JP;

Shigeki Morikami, Tokyo, JP;

Mitsuru Shiokawa, Tokyo, JP;

Assignee:

DISCMA AG, Hünenberg, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 49/46 (2006.01); B29C 49/58 (2006.01); B29C 49/30 (2006.01); B29C 49/08 (2006.01); B29K 23/00 (2006.01); B29K 67/00 (2006.01); B29K 105/00 (2006.01); B29L 31/00 (2006.01); B29C 49/06 (2006.01); B29C 49/14 (2006.01); B29C 49/16 (2006.01);
U.S. Cl.
CPC ...
B29C 49/58 (2013.01); B29C 49/30 (2013.01); B29C 49/46 (2013.01); B29C 49/06 (2013.01); B29C 49/085 (2013.01); B29C 49/14 (2013.01); B29C 49/16 (2013.01); B29C 2049/4664 (2013.01); B29C 2049/5803 (2013.01); B29K 2023/06 (2013.01); B29K 2023/12 (2013.01); B29K 2067/003 (2013.01); B29K 2105/258 (2013.01); B29L 2031/7158 (2013.01);
Abstract

A blow molding device includes a blow molding mold to which a preform is fitted, a blow nozzle that is fitted to a mouth tubular portion of the preform, and a pressurized liquid supply unit configured to supply a pressurized liquid to the blow nozzle, the preform being to be molded into a shape conforming to a cavity of the mold by filling the liquid into the preform through the blow nozzle. The blow nozzle includes a central hole and a plurality of peripheral holes having an inner diameter smaller than an inner diameter of the central hole and arranged to surround the central hole. The liquid is filled into the preform through the central hole and the plurality of peripheral holes.


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