The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2018

Filed:

Jul. 11, 2015
Applicant:

Greatbatch Ltd., Clarence, NY (US);

Inventors:

Robert A. Stevenson, Canyon Country, CA (US);

Xiaohong Tang, Williamsville, NY (US);

William C. Thiebolt, Tonawanda, NY (US);

Christine A. Frysz, Orchard Park, NY (US);

Keith W. Seitz, Clarence Center, NY (US);

Richard L. Brendel, Carson City, NV (US);

Thomas Marzano, East Amherst, NY (US);

Jason Woods, Carson City, NV (US);

Dominick J. Frustaci, Williamsville, NY (US);

Steven W. Winn, Lancaster, NY (US);

Assignee:

Greatbatch Ltd., Clarence, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01J 20/34 (2006.01); A61N 1/375 (2006.01); A61N 1/05 (2006.01); H01G 2/10 (2006.01); H01G 4/35 (2006.01); H01R 43/00 (2006.01); A61N 1/372 (2006.01); C22C 29/12 (2006.01);
U.S. Cl.
CPC ...
A61N 1/3754 (2013.01); A61N 1/05 (2013.01); H01G 2/103 (2013.01); H01G 4/35 (2013.01); H01R 43/00 (2013.01); A61N 1/372 (2013.01); A61N 1/375 (2013.01); B22F 2998/10 (2013.01); C22C 29/12 (2013.01); Y10T 156/1052 (2015.01);
Abstract

A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.


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