The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2018

Filed:

Apr. 25, 2011
Applicants:

Katsuhiko Omae, Chiyoda-ku, JP;

Yoshihito Asao, Chiyoda-ku, JP;

Inventors:

Katsuhiko Omae, Chiyoda-ku, JP;

Yoshihito Asao, Chiyoda-ku, JP;

Assignee:

Mitsubishi Electric Corporation, Chiyoda-ku, Tokyo, JP;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02K 7/20 (2006.01); H05K 7/20 (2006.01); B62D 5/04 (2006.01); H02K 5/22 (2006.01); H02K 7/116 (2006.01); H02M 7/00 (2006.01); H01L 23/00 (2006.01); H02K 11/33 (2016.01); H02P 29/68 (2016.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H02M 7/797 (2006.01); H02K 9/22 (2006.01); H02K 11/02 (2016.01);
U.S. Cl.
CPC ...
H05K 7/2039 (2013.01); B62D 5/0406 (2013.01); B62D 5/0409 (2013.01); H01L 24/34 (2013.01); H02K 5/225 (2013.01); H02K 7/1166 (2013.01); H02K 11/33 (2016.01); H02M 7/003 (2013.01); H02P 29/68 (2016.02); H02K 9/22 (2013.01); H02K 11/024 (2013.01); H02K 2213/12 (2013.01); H02M 7/797 (2013.01);
Abstract

An object is to release heat efficiently to heat-resistance abilities of individual components by enhancing a heat-radiation performance of power circuit components forming a power module () and by enhancing a heat generation balance. The power circuit components formed of power switching elements (and) forming a bridge circuit and a motor relay switching element () are mounted on conductive members () while a heat generation balance is maintained. Then, the conductive members () are disposed on a heat-releasing heat sink () by abutment, and the power circuit components and the heat sink () are integrally molded using mold resin ().


Find Patent Forward Citations

Loading…