The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2018
Filed:
Jan. 22, 2014
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); H05K 5/00 (2006.01); H05K 7/00 (2006.01); H05K 7/02 (2006.01); H05K 7/20 (2006.01); H05K 7/14 (2006.01);
U.S. Cl.
CPC ...
H05K 7/02 (2013.01); H05K 7/1432 (2013.01); H05K 7/209 (2013.01); H05K 7/20409 (2013.01); H01L 2924/0002 (2013.01); Y10T 29/41 (2015.01);
Abstract
A semiconductor module arrangement is provided having a first subassembly, a second subassembly and a third subassembly. The third subassembly has a quantity of adjustment pins which are fixedly connected to one another. The first subassembly has a number N1 of first adjustment openings, and the second subassembly has a number N2 of second adjustment openings. Each of the adjustment pins engages into a different one of the first adjustment openings and/or into one of the second adjustment openings. A corresponding method of producing the semiconductor module arrangement is also provided.