The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2018

Filed:

Sep. 13, 2013
Applicant:

Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;

Inventors:

Dominique Vicard, Bernin, FR;

Jean Brun, Champagnier, FR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/46 (2006.01); H01L 23/10 (2006.01); H01L 23/31 (2006.01); H05K 1/11 (2006.01); H01L 23/00 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/11 (2013.01); H01L 23/10 (2013.01); H01L 23/3157 (2013.01); H01L 24/69 (2013.01); H05K 1/181 (2013.01); H05K 1/182 (2013.01); H05K 3/0091 (2013.01); H05K 3/46 (2013.01); H01L 24/66 (2013.01); H01L 2224/66 (2013.01); H01L 2224/69 (2013.01); H01L 2224/72 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/12041 (2013.01); H05K 2201/09036 (2013.01);
Abstract

The cap () is intended to be assembled with at least one chipped element (), said cap comprising a stack of a plurality of electrically insulating layers () delimiting at least one shoulder () forming a part of a first groove () for housing a wired element (). The cap further comprises: at least one electrical bump contact () arranged at an assembly surface () of the stack intended to be mounted on a face of the chipped element (); at least one electrical connection terminal (') arranged at a wall of the shoulder (); an electrical link element (), electrically linking said electrical connection terminal () to the electrical bump contact ().


Find Patent Forward Citations

Loading…