The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2018

Filed:

Jun. 17, 2015
Applicant:

Siemens Aktiengesellschaft, Munich, DE;

Inventors:

Ruediger Knofe, Teltow, DE;

Bernd Mueller, Falkenberg, DE;

Andrey Prihodovsky, Bayreuth, DE;

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/30 (2006.01); H05K 1/11 (2006.01); H05K 3/32 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0212 (2013.01); H05K 1/11 (2013.01); H05K 3/30 (2013.01); H05K 3/321 (2013.01); H05K 3/34 (2013.01); H05K 2201/06 (2013.01); H05K 2201/10053 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10166 (2013.01);
Abstract

A method for producing or disassembling an electronic assembly are provided. The assembly may have a heating device integrated into a substrate. The heating device can be heated via an external power supply during the assembly process so that, for example, solder connections of an electric component can be melted. The heating device can also be used when operating the electronic assembly, and the heating device can then be directly actuated by the component. For this purpose, an electric connection is then established between the component and the heating device, the connection not yet being provided during the thermal assembly process in order to protect the electronic components of the circuit from being damaged.


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