The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2018
Filed:
Sep. 14, 2015
Dicon Fiberoptics, Inc., Richmond, CA (US);
Ho-Shang Lee, El Sobrante, CA (US);
Brian I-Yuan Chiang, El Sobrante, CA (US);
Junying Lu, Castro Valley, CA (US);
Robert Eric Schleicher, Danville, CA (US);
DICON FIBEROPTICS, INC., Richmond, CA (US);
Abstract
An LED array includes three or more strings of bare LEDs mounted in close proximity to each other on a substrate. The strings of LEDs emit light of one or more wavelengths of blue, indigo and/or violet light, with peak wavelengths that are less than 490 nm. Luminescent materials deposited on each of the LED chips in the array emit light of different wavelength ranges that are of longer wavelengths than and in response to light emissions from the LED chips. A control circuit applies currents to the strings of LEDs, causing the LEDs in the strings to emit light, which causes the luminescent materials to emit light. A user interface enables users to control the currents applied by the control circuit to the strings of LEDs to achieve a Correlated Color Temperature (CCT) value and hue that are desired by users, with CIE chromaticity coordinates that lie on, or near to the black body radiation curve. Preferably a transparent material is dispensed on the substrate between the LED semiconductor chips to substantially surround the LED semiconductor chips. Thereafter at least one layer containing luminescent materials is applied on the LED semiconductor chips and the transparent material.