The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2018

Filed:

Jan. 28, 2015
Applicant:

Analog Devices Global, Hamilton, BM;

Inventors:

Seamus Paul Whiston, Raheen, IE;

Bernard Patrick Stenson, Limerick, IE;

Michael Noel Morrissey, Ballingarry, IE;

Michael John Flynn, Waterford, IE;

Assignee:

Analog Devices Global, Hamilton, BM;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); H05K 1/18 (2006.01); H03H 9/17 (2006.01); H03H 9/46 (2006.01); H03H 9/22 (2006.01); H03H 9/15 (2006.01); H03H 9/24 (2006.01); H03H 9/02 (2006.01);
U.S. Cl.
CPC ...
H03H 9/462 (2013.01); H03H 9/174 (2013.01); H03H 9/22 (2013.01); H03H 2009/02165 (2013.01); H03H 2009/155 (2013.01); H03H 2009/2421 (2013.01);
Abstract

A method of trimming a component is provided in which the component is protected from oxidation or changes in stress after trimming. As part of the method, a protective glass cover is bonded to the surface of a semiconductor substrate prior to trimming (e.g., laser trimming) of a component. This can protect the component from oxidation after trimming, which may change its value or a parameter of the component. It can also protect the component from changes in stress acting on it or on the die adjacent it during packaging, which may also change a value or parameter of the component.


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