The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2018

Filed:

Jan. 18, 2017
Applicant:

National Tsing Hua University, Hsinchu, TW;

Inventors:

Jwo-Huei Jou, Hsinchu, TW;

Tsung-Han Li, Tainan, TW;

Saulius Grigalevi{hacek over (c)}ius, Kaunas, LT;

Gintare Kru{hacek over (c)}aite, Kupiskio District, LT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/00 (2006.01); C23C 14/26 (2006.01); C23C 14/12 (2006.01); H01L 51/56 (2006.01); H01L 51/50 (2006.01);
U.S. Cl.
CPC ...
H01L 51/001 (2013.01); C23C 14/12 (2013.01); C23C 14/26 (2013.01); H01L 51/0026 (2013.01); H01L 51/56 (2013.01); H01L 51/5012 (2013.01); H01L 51/5016 (2013.01); H01L 51/5056 (2013.01); H01L 51/5072 (2013.01); H01L 51/5088 (2013.01); H01L 51/5092 (2013.01); H01L 51/5096 (2013.01);
Abstract

The primary objective of the present invention is to provide a method for manufacturing organic layers of organic light-emitting device by using deposition machine, which mainly uses the way of premixing organic materials to dissolving and mixing multi kinds of organic materials; moreover, after completing the vacuum drying process to the mixed organic materials, the method is then proceeded for depositing the mixed organic materials on a substrate in single vapor deposition process; after then, the method is proceeded for ended the deposition process to the material carrier and repeatedly operating deposition process to another material container, so as to produce multi-layers structure on the substrate; wherein method proposed by the present invention can replace the conventional manufacturing process and can avoid the disadvantages thereof.


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