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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9887356 B1

PDFFull Text
Date of Patent:
Feb. 06, 2018

Filed:

Jan. 21, 2016

3d printed active electronic materials and devices

Applicants:

Michael C. Mcalpine, Minneapolis, MN (US);

Yong Lin Kong, Cambridge, MA (US);

Inventors:

Michael C. McAlpine, Minneapolis, MN (US);

Yong Lin Kong, Cambridge, MA (US);

Assignee:

THE TRUSTEES OF PRINCETON UNIVERSITY, Princeton, NJ (US);

Attorney:

Meagher Emanuel Laks Goldberg & Liao, LLP

Primary Examiner:

Timor Karimy

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 51/00 (2006.01); H01L 51/56 (2006.01); B29C 64/106 (2017.01); B29C 64/386 (2017.01); H01L 51/50 (2006.01); G02C 7/04 (2006.01); G02C 11/00 (2006.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01); B29K 79/00 (2006.01); B29K 105/00 (2006.01); B29K 25/00 (2006.01); B29K 81/00 (2006.01); B29K 83/00 (2006.01); B33Y 80/00 (2015.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 51/0004 (2013.01); B29C 64/106 (2017.08); B29C 64/386 (2017.08); H01L 51/0012 (2013.01); H01L 51/56 (2013.01); B29K 2025/06 (2013.01); B29K 2079/00 (2013.01); B29K 2081/00 (2013.01); B29K 2083/00 (2013.01); B29K 2105/0073 (2013.01); B29K 2995/0005 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); B33Y 80/00 (2014.12); G02C 7/04 (2013.01); G02C 11/10 (2013.01); H01L 33/005 (2013.01); H01L 51/0037 (2013.01); H01L 51/0059 (2013.01); H01L 51/502 (2013.01); Y02E 10/549 (2013.01);
Abstract

Disclosed is a process whereby diverse classes of materials can be 3D printed and fully integrated into device components with active properties. An exemplary embodiment shows the seamless interweaving of five different materials, including (1) emissive semiconducting inorganic nanoparticles, (2) an elastomeric matrix, (3) organic polymers as charge transport layers, (4) solid and liquid metal leads, and (5) a UV-adhesive transparent substrate layer, demonstrating the integrated functionality of these materials. Further disclosed is a device for printing these fully integrated 3D devices.

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