The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2018

Filed:

May. 10, 2013
Applicants:

Yongping Ding, San Jose, CA (US);

Lei Zhang, Shanghai, CN;

Hong Chang, Saratoga, CA (US);

Jongoh Kim, Portland, OR (US);

John Chen, Palo Alto, CA (US);

Inventors:

Yongping Ding, San Jose, CA (US);

Lei Zhang, Shanghai, CN;

Hong Chang, Saratoga, CA (US);

Jongoh Kim, Portland, OR (US);

John Chen, Palo Alto, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 29/66 (2006.01); H01L 21/265 (2006.01);
U.S. Cl.
CPC ...
H01L 29/78 (2013.01); H01L 21/2652 (2013.01); H01L 21/26586 (2013.01); H01L 29/66348 (2013.01); H01L 29/66666 (2013.01); H01L 29/7827 (2013.01);
Abstract

This invention discloses a semiconductor power device disposed in a semiconductor substrate. The semiconductor power device comprises a plurality of trenches each having a trench endpoint with an endpoint sidewall perpendicular to a longitudinal direction of the trench and extends vertically downward from a top surface to a trench bottom surface. The semiconductor power device further includes a trench bottom dopant region disposed below the trench bottom surface and a sidewall dopant region disposed along the endpoint sidewall wherein the sidewall dopant region extends vertically downward along the endpoint sidewall of the trench to reach the trench bottom dopant region and pick-up the trench bottom dopant region to the top surface of the semiconductor substrate.


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