The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2018

Filed:

Aug. 03, 2017
Applicant:

Cambridge Electronics, Inc., Cambridge, MA (US);

Inventors:

Bin Lu, Watertown, MA (US);

Ling Xia, Belmont, MA (US);

Assignee:

Cambridge Electronics, Inc., Cambridge, MA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/3205 (2006.01); H01L 29/40 (2006.01); H01L 29/45 (2006.01); H01L 29/47 (2006.01);
U.S. Cl.
CPC ...
H01L 29/404 (2013.01); H01L 29/407 (2013.01); H01L 29/454 (2013.01); H01L 29/475 (2013.01);
Abstract

Field-plate structures are disclosed for electrical field management in semiconductor devices. A field-plate semiconductor device comprises a semiconductor substrate, a first ohmic contact and a second ohmic contact disposed over the semiconductor substrate, one or more coupling capacitors, and one or more capacitively-coupled field plates disposed over the semiconductor substrate between the first ohmic contact and the second ohmic contact. Each of the capacitively-coupled field plates is capacitively coupled to the first ohmic contact through one of the coupling capacitors, the coupling capacitor having a first terminal electrically connected to the first ohmic contact and a second terminal electrically connected to the capacitively-coupled field plate.


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