The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2018

Filed:

May. 11, 2016
Applicant:

Delta Electronics, Inc., Taoyuan, CN;

Inventors:

Tao Wang, Taoyuan, CN;

Zhenqing Zhao, Taoyuan, CN;

Zeng Li, Taoyuan, CN;

Kai Lu, Taoyuan, CN;

Assignee:

Delta Electronics, Inc., Taoyuan, Taiwan, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 23/00 (2006.01); H01L 23/053 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 25/07 (2006.01); H01L 23/24 (2006.01);
U.S. Cl.
CPC ...
H01L 25/162 (2013.01); H01L 23/053 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 24/32 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 23/24 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45014 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/4903 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/85801 (2013.01); H01L 2924/00011 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/0133 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/0532 (2013.01); H01L 2924/05032 (2013.01); H01L 2924/05042 (2013.01); H01L 2924/05432 (2013.01); H01L 2924/1205 (2013.01); H01L 2924/1207 (2013.01); H01L 2924/12035 (2013.01); H01L 2924/13023 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1426 (2013.01); H01L 2924/15724 (2013.01); H01L 2924/15738 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/15763 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19107 (2013.01);
Abstract

The present disclosure provides a power module with the integration of a control circuit at least, including: a power substrate; a power device mounted on the power substrate; and at least one control substrate which supports the control circuit, is electrically connected with the power substrate and disposed at an angle of inclination on a surface of the power substrate on which the power device is mounted; wherein the angle of inclination is greater than or equal to 45 degrees and smaller than or equal to 135 degrees. In the power module provided by the present disclosure, only the power substrate as well as the connections between the control substrate and the power substrate occupies the footprint area of the power module, and thus the horizontal footprint area of the power module is effectively reduced and thereby the power density of the power module is increased.


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