The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2018

Filed:

Mar. 26, 2015
Applicant:

Harvatek Corporation, Hsinchu, TW;

Inventors:

Hsin-I Lu, Hsinchu County, TW;

Hui-Yen Huang, Hsinchu, TW;

Yu-Ching Kuo, Hsinchu, TW;

Yu-Ping Wang, Hsinchu, TW;

Jen-Hung Chang, Hsinchu County, TW;

Assignee:

Harvatek Corporation, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); H01L 33/54 (2010.01); H01L 33/62 (2010.01); F21K 99/00 (2016.01); F21V 3/00 (2015.01); F21K 9/238 (2016.01); F21K 9/232 (2016.01); F21Y 103/10 (2016.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); F21K 9/238 (2016.08); F21K 9/232 (2016.08); F21Y 2103/10 (2016.08); F21Y 2115/10 (2016.08); H01L 33/62 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A light emitting diode device including a substrate, a plurality of light emitting elements, and an encapsulant. The substrate has a front surface and a back surface opposite to the front surface. The substrate includes a first portion and a second portion. The first portion has a plurality of light-penetrating holes. The second portion is separated from the first portion. The light emitting elements are disposed adjacent to the light-penetrating holes and on the front surface of the first portion. The encapsulant is disposed on the front surface of the substrate, and covers the light emitting elements.


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