The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2018
Filed:
Dec. 10, 2014
Applicant:
Stmicroelectronics S.r.l., Agrate Brianza, IT;
Inventors:
Alberto Pagani, Nova Milanese, IT;
Giovanni Girlando, Catania, IT;
Federico Giovanni Ziglioli, Pozzo d'adda, IT;
Alessandro Finocchiaro, Catania, IT;
Assignee:
STMICROELECTRONICS S.R.L., Agrate Brianza (MB), IT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/58 (2006.01); G01R 31/28 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); G01R 31/2872 (2013.01); H01L 23/585 (2013.01); H01L 22/14 (2013.01); H01L 2924/0002 (2013.01);
Abstract
An IC may include a semiconductor substrate having circuitry formed in the substrate, an interconnect layer above the semiconductor substrate and having an antenna coupled to the circuitry, and a seal ring around a periphery of the interconnect layer. The IC may include an electrically insulating trench extending vertically into the semiconductor substrate and extending laterally across the semiconductor substrate from adjacent one side to adjacent another side.