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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9887163 B1

PDFFull Text
Date of Patent:
Feb. 06, 2018

Filed:

Apr. 01, 2016

Semiconductor package and method of manufacturing the same

Applicant:

Hana Micron Inc., Asan-si, KR;

Inventors:

Hyun Joo Kim, Cheonan-si, KR;

Seung Hwan Lee, Cheonan-si, KR;

Assignee:

Hana Micron Inc., Asan-si, KR;

Attorney:

The Webb Law Firm

Primary Examiner:

Amar Movva

Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/485 (2013.01); H01L 21/4853 (2013.01); H01L 21/565 (2013.01); H01L 23/3114 (2013.01); H01L 23/49811 (2013.01); H01L 23/49838 (2013.01); H01L 24/97 (2013.01); H01L 2021/60022 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/97 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01);
Abstract

The present invention relates to a semiconductor package and a method of manufacturing the same. Specifically, the present invention relates to a semiconductor package including a substrate; a semiconductor chip mounted on the substrate; a connection element including an insulator mounted on the substrate and a first connection part of a conductive material formed at an end of the insulator; a molding part surrounding the semiconductor chip, and sealing the connection element for an upper surface of the first connection part to be exposed; and a shield layer surrounding the molding part, and forming an opening part on a part corresponding to the first connection part.

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