The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2018
Filed:
Sep. 17, 2014
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventor:
Koichiro Nishizawa, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 27/06 (2006.01); H01L 29/45 (2006.01); C23C 18/16 (2006.01); C23C 28/00 (2006.01); C25D 7/12 (2006.01); H01L 21/768 (2006.01); C23C 18/50 (2006.01); H01L 23/532 (2006.01); H01L 21/285 (2006.01); C23C 18/32 (2006.01); C23C 18/54 (2006.01); H01L 21/8252 (2006.01); H01L 23/522 (2006.01); H01L 23/535 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76864 (2013.01); C23C 18/165 (2013.01); C23C 18/1651 (2013.01); C23C 18/1653 (2013.01); C23C 18/1692 (2013.01); C23C 18/32 (2013.01); C23C 18/50 (2013.01); C23C 18/54 (2013.01); C23C 28/00 (2013.01); C25D 7/123 (2013.01); H01L 21/28575 (2013.01); H01L 21/76846 (2013.01); H01L 21/76877 (2013.01); H01L 21/76895 (2013.01); H01L 21/76898 (2013.01); H01L 21/8252 (2013.01); H01L 23/481 (2013.01); H01L 23/5226 (2013.01); H01L 23/535 (2013.01); H01L 23/53238 (2013.01); H01L 23/53252 (2013.01); H01L 27/0605 (2013.01); H01L 29/452 (2013.01); H01L 2924/0002 (2013.01);
Abstract
According to present invention, a semiconductor device includes a semiconductor substrate formed of GaAs, an adhesion layer formed of Pd or an alloy containing Pd on the semiconductor substrate, a barrier layer formed of Co or an alloy containing Co on the adhesion layer, and a metal layer formed of Cu, Ag or Au on the barrier layer.