The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2018

Filed:

Aug. 19, 2015
Applicant:

Synaptics Japan Gk, Tokyo, JP;

Inventors:

Koji Akimoto, Tokyo, JP;

Hisao Nakamura, Tokyo, JP;

Tsutomu Fukaya, Tokyo, JP;

Assignee:

Synaptics Japan GK, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/673 (2006.01); B65D 1/36 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67333 (2013.01); B65D 1/36 (2013.01);
Abstract

A semiconductor chip tray is provided that includes a support plate, a first protruding portion, a second protruding portion and a recess. The first protruding portion forms a housing space for a semiconductor chip by being provided on a top surface of the support plate. The second protruding portion is provided on a bottom surface of the support plate, and is fitted to an outer periphery of the first protruding portion of another semiconductor chip tray when the tray is stacked so as to overlap the other tray. The recess is provided on the bottom surface of the support plate. The recess faces a part of the first protruding portion of another chip tray when the tray is stacked so as to overlap the other tray. The recess is formed extending up to an outside of the first protruding portion from the housing space formed by the first protruding portion.


Find Patent Forward Citations

Loading…