The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2018
Filed:
Jun. 09, 2015
International Business Machines Corporation, Armonk, NY (US);
Martin Eckert, Boeblingen, DE;
Eckhard Kunigkeit, Stuttgart, DE;
Quintino L. Trianni, Boeblingen, DE;
Christian Zoellin, Boeblingen, DE;
International Business Machines Corporation, Armonk, NY (US);
Abstract
A module plate is provided for use with a wafer handler and testing mechanism. The module plate has a diameter equivalent to an integrated circuit wafer and a height equivalent to or less than a height of a module lid associated with each module in a plurality of modules associated with the module plate. The module plate has a plurality of cutouts in the module plate that have a width equivalent to a width of the module lid and at least a length equivalent to a length of the module lid. The height of the module plate is such that, when a test head contacts a module base of each module in a plurality of modules, the module lid contacts a chuck on which the module plate resides during testing of the module thereby providing resistance in order to accurately test the module.