The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2018
Filed:
Aug. 28, 2014
Applicants:
Timo Benzel, Kusterdingen, DE;
Robert Bosch Gmbh, Stuttgart, DE;
Inventors:
Frieder Haag, Wannweil, DE;
Hubert Benzel, Pliezhausen, DE;
Assignee:
ROBERT BOSCH GMBH, Stuttgart, DE;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01L 9/00 (2006.01); B81B 3/00 (2006.01); B81B 7/02 (2006.01); B81C 1/00 (2006.01); B81B 7/00 (2006.01); G01L 19/14 (2006.01);
U.S. Cl.
CPC ...
G01L 9/0052 (2013.01); B81B 3/0021 (2013.01); B81B 7/007 (2013.01); B81B 7/02 (2013.01); B81C 1/00373 (2013.01); G01L 9/0047 (2013.01); G01L 19/148 (2013.01); B81B 2201/0264 (2013.01); B81B 2207/092 (2013.01); B81C 2203/0154 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/49171 (2013.01);
Abstract
A micromechanical sensor system includes a micromechanical sensor chip surrounded at least laterally by a molded housing which has a front side and a rear side. The micromechanical sensor chip includes a chip area on the rear side, which is omitted from the molded housing, and a rewiring device formed on the rear side, which, starting from the chip area, extends to the surrounding molded housing on the rear side, and from there, past at least one via from the rear side to the front side of the molded housing.